Polymeric Materials for Electronics Packaging and Interconnection

Polymeric Materials for Electronics Packaging and Interconnection

Auteur : John H. Lupinski

Date de publication : 1989

Éditeur : American Chemical Society

Nombre de pages : 499

Résumé du livre

Polymers play an increasingly important role in the construction of integrated circuitry and many electronic devices. This new volume provides an overview of this important topic with an emphasis on the chemical and materials properties of polymers for electronic packaging. Its 39 chapters cover a broad spectrum of topics in four general areas: physical chemistry of materials, properties and applications of encapsulants, properties and applications of gels, and printed circuit board substrates and materials for circuit board substrates. Also includes a review of the marketing trends that drive packaging technology.

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