Area Array Packaging Handbook
Auteur : Ken Gilleo
Date de publication : 2002
Éditeur : Mcgraw-hill
Nombre de pages : 1000
Résumé du livre
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)